MiScan series laser graphic direct writing equipment saves tedious Mask processing steps and provides rapid, efficient and low-cost optical engraving process solutions. Especially for users who have the external coordination requirements of photoengraving Mask, they can make their own corresponding masks to reduce costs or improve the development speed requirements.This product USES high power semiconductor laser light source, long life and low power consumption;User interface friendly and flexible, support a variety of layout design format;Can be based on their own needs, convenient and flexible choice of different projection multiplier to achieve a variety of modes of exposure.

The Microlabl, a novel model of laser pattern generator or direct writing system with SLM technology(spatial light modulator) with 4-motion axises, has been designed to fabricate the precision micro-patterns, grayscale lithography on the planar or curved surfaces under the rectangular or polar coordinates.

By using iGrapher's Beam Tile Flash Patterning( BTFP) mode, it takes less than 0.5 hours for 6" wafer patterning of 0.1um resolution for integrated circuit masks, and 0.2 hours in the high speed mode. That is the industry-leading exposure rate, extremely fast!

NanoCrystal200 is specially designed for nano-patterning of meta-surface, nano-devices and materaials with resolution of 100nm.

The HoloScanV is an advanced large format holoraphic mastering system to fabricate the masters for 3D holograms, optical variable devices, diffraction patterns and sub-wavelength optics on the ultra-large substrates.

The customized micro-nano optics(CMN) center at SVG Optronics offers a full service from design and manufacturing up to the characterization of micro-nano optical elements for EUV to FIR applications and their processing and assembly in whole systems.

With the several years R&D acitivities, the excellent engineers and facilities make the iEngraver, the molding system, achieve the high quality and powerful performances.

The hollow mask: graphics resolution 1u, hollow opening >40um, thickness 50um, substrate Ni. The purposes: OLED organic vapor deposition, the microelectrode hollow mask plate, the solar battery halftone: 50um line-width halftone.

the HoloMakerIIIc, the HoloMakerIIIb, the HoloScanV, iGrapher200-800 and the Microlab100.