Microlab:4 axis pattern generator

Application scenarios
 
>>Microstructure optical device: two-dimensional and three-dimensional microstructure
 >>Plasma etching (ICP) mask, precision graphics
 >>
LIGA mould
 >>Microlens array
 >>Binary optical elements
 >>Optical grating
 >>Blazed grating
 >>Iffraction pattern: 3 d graphics, CGH (Computer Generated Hologram)
 >>Array devices: MLA, Fresnel lens
 >>Coupler: Outcoupling devices

Technical features
 >>Maskless laser direct writing 
 >>Fast lithography can be realized by using high precision DMD direct writing
 >>High precision piezoelectric ceramic motor with positioning resolution of 10nm
 >>Automatic focus and CCD alignment, double-sided alignment
 >>Step exposure, gray exposure, laser drag exposure (integral exposure with a shaped aperture)
 >>Advanced processing (glint groove, microlens array, etc.)
 >>Support GDSII, DXF, BMP and other file formats

Customer value
 >>Short R&D cycle, low cost, easy to use
 >>High cost performance products, small footprint, complete functions
 >>Stable performance and simple maintenance have been widely used in universities and research institutes

 


 

Specification parameter
 


The Microlab, a novel model of  laser pattern generator or direct writing system with SLM technology(spatial light modulator) with 4-motion axises,  has been designed to fabricate the precision micro-patterns, grayscale lithography on the planar or curved surfaces under the rectangular or polar coordinates.

The minimum spot can be achieved to less than sub-wavelength to exposure phase-levels with binary structures with beam-shaper for the micro-structure devices.

F
eatures

The SLM is the basis of a new micro-pattern generation technology that is fundamentally different from current AOM technologies. The SLM technology unites laser productivity with e-beam-like high-resolution, creating a powerful micro-pattern generator with the potential to extend through many generations of technology.|

The almost outdated Pattern Generators use a system of raster scan technology, which are common today. These systems use a focused laser beam to write arbitrary microstructures with minimum features sizes down to 600 nm on almost any material.

Compared to E-Beam lithography, which is at the cost of a very slow writing speed and a high cost of ownership, MicroLab100 is an alterative tool to write the sub-wavelength structures with low cost. To write high quality microstructures down to 280 nm in a short time, a Maskless Laser Lithography System with SLM technology is most likely the right choice. 

It eliminates the turnaround time needed for the mask making process and makes it quick and easy to adjust a prototype design. 

The Microlab is suitable to  be used stand along under the rectangular or polar coordinates and has the benefit to shoot the 280nm resolution patterns with time and cost-effective compared with e-beam lithography. 

The Microlab is used to fabricate the micro-optical devices, masks,CGH's, beam shapers, diffractive or refractive lens and lens array.

The Microlab has four axis controlling parameters (x-y-z-theta) to support for writing the patterns on the concave or convex surfaces with automatic focusing system.

It is very difficult to write the lines with deep grooves on the thick layer photoresist. With grayscale lithography it is possible to create 3D microstructures with high quality in a thick layer of photoresist. The fastest and easiest way to do this is with a maskless laser lithography system, which uses an intensity modulated laser beam, or the superimosed exposures to write the structures directly into the photoresist.

Applying a binary optical algorithm, spuperimposing mode based on the SLM technology, iGrapher realizes the high quality of 64 phase structures or continuous relief on the surface of photoresist with the high speed by using superimposed square beam to get uniform intensity.

Using data from an electronic design, the SLM laser lithography system will expose the resist with a variable dose and the 3D structures will remain in the resist after the development process. The resist is applied to the substrate by spin- or spray-coating and can be several to 50 microns. 

The final result of this entire process depends on the electronic data, the laser writing and the development, and all of these steps can be independently tuned to produce the best result. This makes it very efficient and economical for product development, as there are no expensive gray tone masks needed in the process.