MiScan:laser graphic writing equipment

Application scenarios
 >> Universities, research institutes and enterprises
 >>The new generation of high speed and high precision graphic equipment meets small batch production
 >>Integrated circuits, MEMS, microoptics, microfluidics, sensors, computer holograms

Technical features
 >>High precision linear motor motion platform, support 8 "base
 >>High power 405nm LD laser (selected with DPSSL ultraviolet laser)
 >>Automatic focus and CCD alignment
 >>Zoned, multi - substrate array exposure
 >>Scanning exposure, Supports grayscale exposure
 >>3D navigation automatically focuses
 >>Support GDSII,DXF,BMP and other file formats

Customer value
 >>Cost-effective products
 >>High yield can satisfy small batch production

Specification parameter

 

 

MiScan series laser graphic direct writing equipment saves tedious Mask processing steps and provides rapid, efficient and low-cost optical engraving process solutions. Especially for users who have the external coordination requirements of photoengraving Mask, they can make their own corresponding masks to reduce costs or improve the development speed requirements.This product USES high power semiconductor laser light source, long life and low power consumption;User interface friendly and flexible, support a variety of layout design format;Can be based on their own needs, convenient and flexible choice of different projection multiplier to achieve a variety of modes of exposure.


MiScan is the latest universal product, which can achieve 0.8um sub-micron resolution lithography and 0.5um sleeve engraving precision. Its main technical features are as follows:

  1. Advanced technology:Contrast in Nuflare JEOL/ETEC/Heidelberg/Micronic manufacturer 's first generation of single or wire direct writing technology, SVG,Adopt international advanced maskless of the second generation surface spatial light technique:Spatial light modulated technology, using step and high-speed scanning technology, the combination of faster, higher capacity,Can be applied to 350nm node non-critical layer mask in large scale IC production version to the direct write lithography and 0.8m node device.
  2. Flexible and efficient: adopting maskless direct lithography technology to eliminate tedious Mask processing steps, reduce the cost of r&d and production, shorten the r&d cycle, and have a variety of working modes such as rapid and fine exposure mode and Mask/ wafer device making.
  3. Widely used: with its unique design advantages, the direct writing lithography machine can be widely used in the fields of integrated circuit design and manufacturing, mask manufacturing, thin film circuit manufacturing, MEMS design and manufacturing, microelectronics and biological chips, etc.
  4. Wide compatibility: widely support BMP,GDS,TDB,DXF(AutoCAD R2000),CIF, GDS2 Gerber(optional) and other multi-layout design formats.
  5. Tailor-made: tailor-made special functions according to customer demands, such as intelligent micro-environment control module, data conversion in various formats, etc., to meet the needs of different application customers.
  6. Professional/efficient service:30 minutes of telephone response,24 hours of on-site service for the engineers of the original factory in mainland China.
  7. Low cost maintenance: stable and efficient system, low failure rate, long service life of components; Compact size; Modular design, easy to maintain.
  8. High cost performance: advanced direct writing technology, high productivity thick glue, high quality equipment, competitive price advantage.
  9. Easy to operate: it adopts the mode of JOB and RECIPE to establish multi-scene working mode. It has a user-friendly user interface and is simple and easy to operate.